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Hot Melt DTF Adhesive Powder White For EPSON L1800 DX5 XP600

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Province/State:guangdong
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Hot Melt DTF Adhesive Powder White For EPSON L1800 DX5 XP600

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Brand Name :More Color
Model Number :MT_226
Certification :SGS
Place of Origin :Guangdong,china
MOQ :1kg
Price :Discussible
Payment Terms :L/C, D/A, D/P, T/T, Western Union, MoneyGram
Supply Ability :500kg week
Delivery Time :10-15days
Packaging Details :Carton
Country of origin :CHINA GUANGDONG
Classification :Other Adhesives
MF :Dtf Hot Melt Powder
Hardness :80±3 Shore A
Washing Resstance :60℃
Appearance :White powder
Shipping Way :By Express or By Sea
Application :Direct printing on clothes
State :Solid
Usage :Fiber & Garment, Footwear &Leather, Packing
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Heat Transfer White TPU Adhesives DTF Hot Melt Powder For EPSON L1800/DX5/XP600/L1300

This product is a polyurethane thermoplstic powder hot melt adhesive. Soft feel and certain resilience, excellent processability. Excellent adhesion to fabric, cotton, blended fabric, TPU. MT226 is used in clothing, shoe, luggage materials and heat transfer industries.

Product Superiority

Prerequisites for the first DTF print : Like we mentioned above, DTF are extremely cost-effective and therefore do not require a large investment.

Film : Your will be printing directly on film, hence the process name" direct to film ". DTF film is available in sheet and roll form.

Software : You can use any software directly for clothing, plus it makes your life easier. You can adjust the whiteness of your prints for a softer feel without sacrificing quality.

It’s like "glue" that bonds the print to the fabric of your choice.

Ink : Can be used directly on garments or any textile ink.

Hot Press : Tested to be equal to or better than traditional direct-to-garment(DTG) printing.

Dryer : An optional curing oven/ dryer can be used to melt the binder powder for faster production.

Product Name Hot Melt Adhesive Powder
Model MT-226
Property Criterion
Comeposition Polyurethane
Usage DTF heat transfer
Bag/ carton 20bag/ carton
Appearance White powder
Bond Temperature 125 -145
Bond Dwell time 10 -15S
Powder Size Range 80 -200um
Type Hot melt adhesive powder for heat transfer

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